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HomeMaterials Science ForumMaterials Science Forum Vols. 510-511Modeling for Optimum Thermal Property of...

Modeling for Optimum Thermal Property of Wave-Typed Heat Sink by Computational Simulation

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Eco-Materials Processing & Design VII

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Periodical:

Materials Science Forum (Volumes 510-511)

Pages:

406-409

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.510-511.406

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Online since:

March 2006

Authors:

Byung Geel Yu

Keywords:

Aluminum (Al), Forced Convection, Icepak Program, Thermal Resistance, Wave Heat Sink

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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