Design of Automatic Matching System for Very High Frequency Plasma-Enhanced Processes

Yuji Yoshizako; Daisuke Matsuno

doi:10.4028/www.scientific.net/MSF.512.239

Paper Titles

Low Temperature Synthesis of TiO₂ / SrTiO₃ Films on Ti Substrate
p.217

Microstructures Formed by Charge Ordering Transition in Pr_0.55Ca_0.45MnO₃ and Nd_0.5Sr_0.5MnO₃
p.223

Strong Localization of Electromagnetic Wave in Ceramic/Epoxy Photonic Fractals with Menger-Sponge Structure
p.227

Stability of the B2-Type Structure of Ti-Ni-Fe and Ti-Ni-Co Shape Memory Alloys
p.233

Design of Automatic Matching System for Very High Frequency Plasma-Enhanced Processes
p.239

Recent Development of New Alloys for Biomedical Use
p.243

Electrochemical Characterization of Ti and Ti Base Alloys under Simulated Body Fluid Environment
p.249

Crystallographic Approach to Regenerated and Pathological Hard Tissues
p.255

Role of Stress Distribution on Healing Process of Preferential Alignment of Biological Apatite in Long Bones
p.261

HomeMaterials Science ForumMaterials Science Forum Vol. 512Design of Automatic Matching System for Very High...

Design of Automatic Matching System for Very High Frequency Plasma-Enhanced Processes

Abstract:

Since it can change electron energy distribution functions, very high frequency (VHF) plasma has gained significant attention as a promising new class of plasma. We demonstrate an automatic matching system for VHF plasma, that works in very wide ranges. A matching system was prepared using conventional variable capacitors. Reflection coefficient at the input of the matching circuits was measured with a directional coupler. A new calculation method for automatic matching based on numerical models for the circuit was developed, and the performance of the automatic matching system was evaluated using a load emulator. These results revealed that the system has an automatic matching capability for the entire range of the covering load area.

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Periodical:

Materials Science Forum (Volume 512)

Pages:

239-242

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.512.239

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Online since:

April 2006

Authors:

Yuji Yoshizako, Daisuke Matsuno

Keywords:

Automatic Matching System, Plasma-Enhanced Process, Very High Frequency Plasma

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