Interfacial and Surface Characterization of Fluorine Treated SnAgCu and NiTi Powders and NiTi/SnAgCu Composite Materials
NiTi shape memory alloy particles have been incorporated inside SnAgCu lead free solder paste in order to improve the mechanical performances of solder paste. However, because of the non-wetting properties of solid NiTi particles by the liquid SnAgCu matrix, the development of fluorine gas treatment of both NiTi and SnAgCu particles has been optimized. Scanning electron microscopy (SEM) micrographs of NiTi/SnAgCu composite materials have shown that “Fluorine treatment” of SnAgCu powders lead to a huge increase of the NiTi powder content inside the liquid SnAgCu matrix where no effect have been observed when NiTi materials are fluorinated. Xray photoelectron spectroscopy analysis of treated SnAgCu powders have been used in order to analyze surface chemistry evolution where wavelength dispersion spectroscopy line profiles, across NiTi-SnAgCu interfaces, have been performed.
Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim
J. F. Silvain et al., "Interfacial and Surface Characterization of Fluorine Treated SnAgCu and NiTi Powders and NiTi/SnAgCu Composite Materials", Materials Science Forum, Vols. 534-536, pp. 1461-1464, 2007