Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying

Abstract:

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Tungsten coatings with different interlayers onto the oxygen-free copper substrates were fabricated by atmosphere plasma spraying. The effects of different interlayers of NiCrAl, NiAl and W/Cu on bonding strength were studied. SEM, EDS and XRD were used to investigate the photographs and compositions of these coatings. The tungsten coatings with different initial particle sizes resulted in different microstructures. Oxidation was not detected in the tungsten coating, but in the interlayer, it was found by both XRD and EDS. The tungsten coating deposited directly onto the copper substrate presented higher bonding strength than those with different interlayers.

Info:

Periodical:

Materials Science Forum (Volumes 534-536)

Edited by:

Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim

Pages:

425-428

DOI:

10.4028/www.scientific.net/MSF.534-536.425

Citation:

S. X. Song et al., "Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying", Materials Science Forum, Vols. 534-536, pp. 425-428, 2007

Online since:

January 2007

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$35.00

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