Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying

Shu Xiang Song; Zhang Jian Zhou; Juan Du; Zhi Hong Zhong; Chang Chun Ge

doi:10.4028/www.scientific.net/MSF.534-536.425

Paper Titles

Correlations between In-Flight Particles, Splats and Coating Microstructures of Ni20Cr Thermally Sprayed by Flame and Arc Spray Processes
p.409

Effect of Gun Nozzle Geometry, Increase in the Entrance Convergent Section Length and Powder Injection Position on Cold Sprayed Titanium Coatings
p.413

Experimental Investigation and Modeling of the Specific Enthalpy Distribution in a Spray Cone
p.417

Fabrication of Ti(Al,O)-Al₂O₃ Powder Feedstock for Thermal Spraying and Evaluation of Composite Coating
p.421

Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying
p.425

Porosity in Spray-Formed Materials
p.429

Present Status and Future Prospects of Cold Spraying
p.433

Spray Forming of Mg₂Si Rich Aluminum Alloys
p.437

Study on Metal/Diamond Binary Composite Coatings by Cold Spray
p.441

HomeMaterials Science ForumMaterials Science Forum Vols. 534-536Microstructure and Bonding Strength of Tungsten...

Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying

Abstract:

Tungsten coatings with different interlayers onto the oxygen-free copper substrates were fabricated by atmosphere plasma spraying. The effects of different interlayers of NiCrAl, NiAl and W/Cu on bonding strength were studied. SEM, EDS and XRD were used to investigate the photographs and compositions of these coatings. The tungsten coatings with different initial particle sizes resulted in different microstructures. Oxidation was not detected in the tungsten coating, but in the interlayer, it was found by both XRD and EDS. The tungsten coating deposited directly onto the copper substrate presented higher bonding strength than those with different interlayers.

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Materials Science Forum (Volumes 534-536)

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425-428

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.534-536.425

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Online since:

January 2007

Authors:

Shu Xiang Song, Zhang Jian Zhou, Juan Du, Zhi Hong Zhong, Chang Chun Ge

Keywords:

Bonding Strength, Copper (Cu), Microstructure, Plasma Spraying, Tungsten

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References

[1] H. Bolt, V. Barabash, W. Krauss, et al, J. Nucl. Mater. Vol. 329-33 (2004), p.66.

Google Scholar

[2] M. Shimada, A.E. Costley, G. Federici, et al, J. Nucl. Mater. Vol. 337-339 (2005), p.808.

Google Scholar

[3] V. Barabash, G. Federici, J. Linke et al, J. Nucl. Mater. Vol. 313 (2003), p.42.

Google Scholar

[4] H. Bolt, V. Barabash, G. Federici et al, J. Nucl. Mater. Vol. 43 (2002), p.307.

Google Scholar

[5] M. Roedig, W. Kuehnlein, J. Linke, et al, Fus. Eng. Des. Vol. 61-2 (2002), p.135.

Google Scholar

[6] I. Smid, M. Akiba, G. Vieider, et al, J. Nucl. Mater. Vol. 263 (1998), p.160.

Google Scholar

[7] J. Boscary, S. Suzuki, K. Nakamura, et al, Fus. Eng. Des. Vol. 39-4 (1998), p.537.

Google Scholar

[8] K. Nakamura, S. Suzuki, T. Tanabe, et al, Fus. Eng. Des. Vol. 39-4 (1998), p.295.

Google Scholar

[9] H. Maier, in: The Fifth Pacific Rim International Conference on Advanced Materials and Processing, Beijing, China (2005), p.1377.

Google Scholar

[10] X. Liu, S. Tamura, K. Tokunaga, et al, Plasm. Sci. Tech. Vol. 5 (2003), p.1887.

Google Scholar