Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature

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Periodical:

Materials Science Forum (Volumes 558-559)

Edited by:

S.-J.L. Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda and Y. Ikuhara

Pages:

1261-1264

Citation:

K. Pantleon and M. A.J. Somers, "Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature", Materials Science Forum, Vols. 558-559, pp. 1261-1264, 2007

Online since:

October 2007

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