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HomeMaterials Science ForumMaterials Science Forum Vols. 558-559Evolution of the Microstructure in...

Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature

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Recrystallization and Grain Growth III

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Periodical:

Materials Science Forum (Volumes 558-559)

Pages:

1261-1264

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.558-559.1261

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Online since:

October 2007

Authors:

Karen Pantleon, Marcel A.J. Somers

Keywords:

Copper (Cu), Electrochemical Deposition, Self-Annealing, Texture, X-Ray Diffraction (XRD)

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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