Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds

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Periodical:

Materials Science Forum (Volumes 561-565)

Main Theme:

Edited by:

Young Won Chang, Nack J. Kim and Chong Soo Lee

Pages:

539-542

DOI:

10.4028/www.scientific.net/MSF.561-565.539

Citation:

S. Kitaoka et al., "Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds", Materials Science Forum, Vols. 561-565, pp. 539-542, 2007

Online since:

October 2007

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$35.00

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