Paper Titles

Synthesis of Ultra-Fine and High-Pure Zirconium Diboride Powders Using Solution-Based Processing
p.523

Simultaneous Synthesis and Consolidation of W-Added ZrB₂ by Pulsed Electric Current Pressure Sintering and their Mechanical Properties
p.527

Silicon Nitride/Boron Nitride Composite by Combustion Synthesis
p.531

Grain Growth Behavior of Al₂O₃-ZrO₂ with a Small Amount of Zirconia
p.535

Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds
p.539

Fabrication Processes and Properties of Highly Pure MgAlON Materials
p.543

Development of Efficient Metal Catalyst Support
p.547

Microstructure and Electrical Properties of Calcium Copper Titanate Ceramics
p.551

Negative Thermal Expansion in Mn₃Ga(Ge,Si)N Anti-Perovskite Materials
p.557

HomeMaterials Science ForumMaterials Science Forum Vols. 561-565Design of Mold Materials for Encapsulating...

Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds

Article Preview

Abstract:

You might also be interested in these eBooks

PRICM 6

Info:

Periodical:

Materials Science Forum (Volumes 561-565)

Pages:

539-542

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.561-565.539

Citation:

Cite this paper

Online since:

October 2007

Authors:

Satoshi Kitaoka, Naoki Kawashima, Keiji Maeda, Takaki Kuno, Yoshinori Noguchi

Keywords:

Acid Base Interaction, Adhesion, Isoelectric Point, Mold

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2007 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: