Structural and Electrical Properties of Vanadium Tungsten Oxide Thin Films Grown on Pt/TiO2/SiO2/Si Substrates

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Abstract:

The V1.9W0.1O5 thin films deposited on Pt/Ti/SiO2/Si substrates by RF sputtering method exhibited fairly good TCR and dielectric properties. It was found that film crystallinity, dielectric properties, and TCR properties were strongly dependent upon the annealing temperature. The dielectric constants of the V1.9W0.1O5 thin films annealed at 300°C were 37.7, with a dielectric loss of 2.535, respectively. Also, the TCR values of the V1.9W0.1O5 thin films annealed at 300°C were about -3.7%/K.

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73-76

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January 2008

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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[1] A. Tanaka, S. Matsumoto, et. al, IEEE Transactions on Electron Devices, Vol. 43, (1996) p.1844.

Google Scholar

[2] D. Manno, A. Serra, M. Di Giulio, Appl. Phys. Lett. Vol. 61, (1997) p.2709.

Google Scholar

[3] Y. Shimizu, K. Nagase, N. Miura, N. Yamazoe, Jpn. J. Appl. Phys. Vol. 29, (1990) p. L1708.

Google Scholar

[4] Y. Zhao, Z. C. Feng, Y. Liang, Appl. Phys. Lett. Vol. 71, (1997) p.2227.

Google Scholar

[5] D. Barreca, J. Electrochem. Soc. Vol. 146, (1999) p.551.

Google Scholar

[6] F.C. Case, J. Vac. Sci. Technol. Vol. 4 (2002) p.234.

Google Scholar

[7] J.F. Denatale, P. J. Wood, A.B. Harker, J. Appl. Phys. Vol. 66, (1989) p.5844.

Google Scholar