The Effects of Substrate Temperature on the Residual Stress for EBPVD TBCs

Ye Sheng Zhong; Li Ping Shi; Jia Yu; Xiao Dong He

doi:10.4028/www.scientific.net/MSF.575-578.1276

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The Effects of Substrate Temperature on the Residual Stress for EBPVD TBCs
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HomeMaterials Science ForumMaterials Science Forum Vols. 575-578The Effects of Substrate Temperature on the...

The Effects of Substrate Temperature on the Residual Stress for EBPVD TBCs

Abstract:

The preparation technologies of thermal barrier coating by the Electron Beam Physical Vapor Deposition (EBPVD) technique were briefly introduced in this paper. And design principal of thermal barrier coating is discussed, at the same time the selection of raw material was also taken into account. On the basis of several assumed perfect conditions, a reasonable Finite Element Analysis (FEA) physical model was built up in order to exactly describe the whole deposition process. Taking the advantage of the large-scale commercial software of FEA, the distribution of residual stress and the possible displacement tendency were obtained. The analysis results show that: with the increasing substrate preheating temperature, the inter-laminar shear stress increases but the axial residual stress decreases. And the probability of cracking after de-bonding tends to enhance as the thickness of deposition coating is increased. Also it is verified that the FE model has produced little numerical error.