Tail Breaking Force in Thermosonic Wire Bonding with Novel Bonding Wires

J. Lee; Michael Mayer; Y. Zhou; S.J. Hong; S.M. Lee

doi:10.4028/www.scientific.net/MSF.580-582.201

Paper Titles

Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM
p.177

Reproducing the Shilla Dynasty’s Direct-Bonding Granulation Process
p.183

Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball
p.191

Characterization of Contact Formation Process for High Efficiency Solar Cell Using Design of Experiment (DOE)
p.197

Tail Breaking Force in Thermosonic Wire Bonding with Novel Bonding Wires
p.201

High Dissolution Rate of Solid Materials in Molten Lead-Free Solders
p.205

Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation
p.209

Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)
p.213

An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
p.217

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Tail Breaking Force in Thermosonic Wire Bonding with Novel Bonding Wires

Abstract:

Tail breaking forces (TBFs) are measured for various process conditions to understand phenomena such as short tail formation. TBFs obtained with several Cu wires are compared to find the most suitable Cu wire type that improves consistent tail formation. In situ online TBF measurement method is developed. The highest TBF obtained is 61.59 + 9.10mN. The highest Cpk value obtained is 2.97 + 0.33 when lower specification limit of 10 mN is assumed.