High Dissolution Rate of Solid Materials in Molten Lead-Free Solders

Tadashi Takemoto

doi:10.4028/www.scientific.net/MSF.580-582.205

Paper Titles

Reproducing the Shilla Dynasty’s Direct-Bonding Granulation Process
p.183

Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball
p.191

Characterization of Contact Formation Process for High Efficiency Solar Cell Using Design of Experiment (DOE)
p.197

Tail Breaking Force in Thermosonic Wire Bonding with Novel Bonding Wires
p.201

High Dissolution Rate of Solid Materials in Molten Lead-Free Solders
p.205

Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation
p.209

Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)
p.213

An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
p.217

Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
p.221

HomeMaterials Science ForumMaterials Science Forum Vols. 580-582High Dissolution Rate of Solid Materials in Molten...

High Dissolution Rate of Solid Materials in Molten Lead-Free Solders

Abstract:

Sn-based lead-free solders have some characteristics that are different from the conventionally used Sn-Pb eutectic. One is the high dissolution rate of metals and alloys into molten lead-free solder. Several problems due to this high dissolution rate were reviewed. The prominent materials that suffered from this high dissolution rate are copper and iron based. High dissolution rate of Cu resulted in thick Cu-Sn intermetallic compound formation during soldering and Cu enrichment in wave soldering bath. The iron-based materials used for soldering equipments are damaged by erosion. Suppression of the dissolution rate is important to secure quality of micro-soldered joints, to prevent contamination of solder bath and to prolong the life of soldering equipments. The method of suppressing dissolution in practical soldering operation and some examples of erosion damage are introduced.