Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index

Abstract:

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A tensile test was conducted to evaluate thermal fatigue resistances of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu lead-free solder alloys. The test is based on the strain rate change method to obtain a strain rate sensitivity index (SRSI), m. The m values were investigated at various strains during the tensile test, until fracture. The plots of m and strain where m is measured showed a linear relationship. Therefore, the m value at zero strain, m0, and the gradient of the fitting line, k, were obtained by extrapolation. Using m0 and k values, an estimation of the thermal fatigue resistance of the solder joint was attempted. It was believed that m0 and k can be taken as a guide for developing a new lead-free solder with the excellent thermal fatigue resistance. Moreover, the influences of the aging treatment on m0, k and the microstructure of the solder were also investigated.

Info:

Periodical:

Materials Science Forum (Volumes 580-582)

Edited by:

Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na

Pages:

221-224

DOI:

10.4028/www.scientific.net/MSF.580-582.221

Citation:

K. Yasuda et al., "Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index", Materials Science Forum, Vols. 580-582, pp. 221-224, 2008

Online since:

June 2008

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Price:

$35.00

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