Small-Scale Resistance Welding of Crossed TiNi Fine Wire

Shinji Fukumoto; Shigeru Morikawa; Atsushi Yamamoto

doi:10.4028/www.scientific.net/MSF.580-582.225

Paper Titles

Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation
p.209

Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)
p.213

An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
p.217

Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
p.221

Small-Scale Resistance Welding of Crossed TiNi Fine Wire
p.225

Characteristic of Electrochemical Migration on Flexible Printed Circuit Board
p.229

Analysis of Solder Fatigue in Electronic Packaging Using a Mesh-Insensitive Structural Stress Method
p.233

Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder
p.239

Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder
p.243

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Small-Scale Resistance Welding of Crossed TiNi Fine Wire

Abstract:

Resistance microwelding of fine crossed wires is of increasing industrial importance for medical devices, but the understanding of the process is very limited. A study has been carried on the feasibility of small-scale resistance welding of crossed TiNi fine wire. Welding mechanism is similar to that of small-scale resistance welding of crossed Ni wire, which is mainly four stages (wire cold deformation, surface melting, molten phase squeeze-out and, solid-state bonding). The optimum microstructure and welding parameters were proposed.