Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder

Hiroshi Nishikawa; Akira Komatsu; Tadashi Takemoto

doi:10.4028/www.scientific.net/MSF.580-582.243

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Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder
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Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder
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Reliability Assessment of Lead Free Soldered PWBs
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Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder

Abstract:

The reaction between Sn-Ag (-Co) solder and electroless Ni-P plating was investigated in order to clarify the effect of the addition of Co to Sn-Ag solder on the formation of intermetallic compound (IMC) at the interface and the joint strength at the interface. Sn-Ag-Co solder was specially prepared. The results show that there is little effect of the addition of Co to the Sn-Ag solder on the IMC formation and the thickness of the IMC at the interface. For the pull strength of the solder bump joint, the addition of Co to the solder didn’t strongly affect the pull strength of the solder joints, but it affected the fracture mode of the solder joints.