Influence of a Slip Plane Orientation with Respect to the Shear Plane of ECAP on Microstructure of Copper Single Crystal Subject to One Pressing at Room Temperature

Soichi Katayama; Hiroyuki Miyamoto; Alexei Vinogradov; Satoshi Hashimoto

doi:10.4028/www.scientific.net/MSF.584-586.387

Paper Titles

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Grain Boundary Radiotracer Diffusion of Ni in Ultra-Fine Grained Cu and Cu - 1wt.% Pb Alloy Produced by Equal Channel Angular Pressing
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Influence of a Slip Plane Orientation with Respect to the Shear Plane of ECAP on Microstructure of Copper Single Crystal Subject to One Pressing at Room Temperature
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Grain Refinement of Pure Copper by ECAP
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Influence of a Slip Plane Orientation with Respect to the Shear Plane of ECAP on Microstructure of Copper Single Crystal Subject to One Pressing at Room Temperature

Abstract:

This paper describes the influence of initial crystallographic orientation on the formation of dense shear bands in pure copper single crystals subjected to equal-channel angular pressing (ECAP) for one pass at room temperature. Local orientation change during simple shear by ECAP traced by electron backscatter diffraction (EBSD) indicated that the shear bands were formed when twinning plane and direction become parallel to the macroscopic shear plane and shear direction of simple shear strain, respectively. Orientation splitting associated with shear bands have a twinning relation. The shear bands were delineated by large-angle grain boundaries, having close relation to twinning relation with matrix, suggesting the role of deformation twinning as their nucleation sites. The activation of deformation twinning is suggested and can be rationalized by favorable crystallographic orientation and critical dislocation density as indicated elsewhere by the present authors.