Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements

Chao Ming Lin; Chun Yi Chu; Wei Lin Chang

doi:10.4028/www.scientific.net/MSF.594.163

Paper Titles

Fabrication Micro-Nozzle Plates for Inkjet Print Head Using LIGA Process
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Effects of Substrate Geometry on Performance of Twin-Fluid Atomizer in Metal Powder Production
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Synthesis of Core/Shell Type of Hybrid Magnetic Particle by Using Polyionic Copolymer with Extra Magnetic Field
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Experimental Studies of Meniscus Dynamic Behaviors in a Squeeze-Mode Piezoelectric Inkjet Printhead
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Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements
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Finite Element Prediction of Stack-Die Packages under Board Level Drop Test
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Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading
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Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives
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Analysis of Conventional Spinning Process with Thermal Effects
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HomeMaterials Science ForumMaterials Science Forum Vol. 594Underfill Injection Molding in Flip-Chip Packaging...

Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements

Abstract:

The injection molding IC packaging process involves chip packaging and encapsulation techniques comprising mainly of cavity-filling and curing processes. In this paper, the complex 3D geometries and flow behaviors are simplified and modeled by a 2.5D thin-shell simulation. Important aspects of the cavity-filling process include the choosing of bumps array types, the cavity geometry, the injection process, the packing pressure, and the process temperature. The current investigation considers the filling and curing in the different bumps array types. It is shown that the applicable array arrangement provides improved filling results on the flow front, curing, shear strain-rate and velocity vector distributions. These results show the better choice using the geometry parameters in the bumps array arrangement is to consider the performances of the local and global penetrations together.