A Feasibility Study of Using X-Ray Computer Tomography for Ball Grid Array (BGA) Inspection

Shin Chieh Lin; Hsin I Lu

doi:10.4028/www.scientific.net/MSF.594.331

Paper Titles

Experimental Analysis for the Low-Temperature Growth of Poly-Si Films by Using Double Excimer Laser
p.299

Macro-Micro Modeling Analysis of Melting and Re-Solidification of Thin Si Films by Excimer Laser Annealing
p.306

Stylus Measurement and Error Analysis of Large Slope Angle Lens
p.312

Manufacture of Dye-Sensitized Nano Solar Cells and their I-V Curve Measurements
p.324

A Feasibility Study of Using X-Ray Computer Tomography for Ball Grid Array (BGA) Inspection
p.331

New Tolerance Analysis Model for Normal Mean Shift in Manufacturing Process
p.339

Experiment Study and Numerical Analysis of Flow and Heat Transfer in (110) Silicon Base Microchannel
p.351

Fabrication and Investigation of Curved PDMS Micro Nozzle/Diffuser
p.357

Eliminating Hysteresis Effect of Force Actuator for Profiler Design with Rate Inner Loop Compensation
p.363

HomeMaterials Science ForumMaterials Science Forum Vol. 594A Feasibility Study of Using X-Ray Computer...

A Feasibility Study of Using X-Ray Computer Tomography for Ball Grid Array (BGA) Inspection

Abstract:

It is of interest to study the feasibility of using computing tomography technique on BGA inspection. The effects of system parameters on the quality of the reconstructed images were studied first. The system parameters studied are projection type, projection number, sensor number, and filter. For fan beam projection, there are two additional parameters are studied. They are the fan beam arc angle and the sensor geometry. It was found that the increase in projection number and sensor number generally improve the quality of reconstructed image. The effects of sensor geometry and the fan beam arc angle are not significant. BGA simulation test show the feasibility of using this technique to detect the shape and location of defects inside the BGA.