Development of a Constant Temperature Environment Chamber with High Stability

Kuang Chao Fan; H.M. Wang; Yi Cheng Liu

doi:10.4028/www.scientific.net/MSF.594.78

Paper Titles

A Forging Simulation by Using the Point Collocation Method with a Boundary Layer of Finite Element
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Bending Die Design for a Pre-Formed Sheet Metal with a Golden Finger Feature
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An Optimization Approach to the Displacement Volumes for External Spur Gear Pumps
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Evaluation of UHMWPE Component under Various Positions for UKA
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Development of a Constant Temperature Environment Chamber with High Stability
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Researches of a Novel 2D CMOS Thermal Based Accelerometer
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A Finite Element Investigation into the Changing Channel Angular Extrusion of Brass Alloy
p.90

Fabrication and Analysis of Nano-Aluminum-Induced Low-Temperature Polycrystalline Silicon Film
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Research on Piezoelectric Actuator Driving Method of Creep Resistance
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HomeMaterials Science ForumMaterials Science Forum Vol. 594Development of a Constant Temperature Environment...

Development of a Constant Temperature Environment Chamber with High Stability

Abstract:

In this study, a constant temperature environment chamber with high stability is proposed. In the proposed design, the outer temperature is controlled by the air conditioner, the inner temperature is controlled by the electric current generated to control several thermoelectric cooling units. The separation design of the environment chamber from the cooling system can reduce the vibration caused by the thermoelectric cooling elements. This system adopted the Rake’s System Identification Method to obtain the system model, so that optimum PID parameters can be acquired from the simulation of Matlab Simulink. The results show that the vibration can be effectively reduced and the temperature can be controlled within the range of 20±0.007°C in the steady state.