Formation Enthalpy, Free-Energy and Activity Coefficients of Sn-Pb Eutectic Solders

Gui Sheng Gan; Fang Chen; Rong Chang Zeng; Yun Fei Du; Chang Hua Du

doi:10.4028/www.scientific.net/MSF.610-613.531

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Study on 1/f ^γ Noise Characterization of Metallic Interconnection Electromigration
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Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature
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Formation Enthalpy, Free-Energy and Activity Coefficients of Sn-Pb Eutectic Solders
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Effect of the Content of Cu on Solderability and Mechanical Properties of Bi5Sb Solder Alloy
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Production and Properties of a 90%Si-Al Alloy for Electronic Packaging Applications
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Influence of Mg and Si in the Aluminum on the Thermo-Physical Properties of Pressureless Infiltrated SiCp/Al Composites
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Investigation on Wear- and Corrosion Resistance of TiN Films by CVD
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HomeMaterials Science ForumMaterials Science Forum Vols. 610-613Formation Enthalpy, Free-Energy and Activity...

Formation Enthalpy, Free-Energy and Activity Coefficients of Sn-Pb Eutectic Solders

Abstract:

Based on Miedema’s model, the enthalpy of formation, excess free-energy and partial molar excess free-energy of Sn-Pb binary alloy solders were calculated. The model of the activity coefficient for each component in the solders was established. The diagrams of enthalpy of formation, free energy versus composition and activity versus composition and temperature as well as activity coefficients as a function of composition and/or temperature were drawn. And then the relationship between the activity coefficients of elements Sn/Pb in the solders and temperature was obtained. The approaches to reduction in the volatilization of lead at high temperature were proposed from the point of views that the lead pollution to environment results from its chemical activity in the solder alloys.