Development of Porous Material with High Young’s Modulus and Low Thermal Expansion Coefficient in SiC-Vitrified Bonding Material-LiAlSiO4 System

Abstract:

Article Preview

Machines for manufacturing large scale flat displays are enlarging as the size of glasses increases. This work develops porous materials with a low thermal expansion coefficient and a high Young’s modulus. SiC and LiAlSiO4 were used for a positive and a negative thermal expansion materials, respectively. Compositions of powders for porous materials were determined to obtain a desirable Young’s modulus and thermal expansion coefficient by using SiC-VBM-LiAlSiO4 phase diagram at 20 % of porosity. The empirical values of Young’s modulus and a thermal expansion coefficient are close to the theoretical values by using the diagram. Fabricated porous material had high enough Young’s modulus of 87 GPa, and low enough thermal expansion coefficient of 2 x 10-6 K-1 at temperatures ranging from -17 °C to 190 °C with 22 % of porosity.

Info:

Periodical:

Materials Science Forum (Volumes 620-622)

Edited by:

Hyungsun Kim, JienFeng Yang, Tohru Sekino and Soo Wohn Lee

Pages:

715-718

DOI:

10.4028/www.scientific.net/MSF.620-622.715

Citation:

T. Ono et al., "Development of Porous Material with High Young’s Modulus and Low Thermal Expansion Coefficient in SiC-Vitrified Bonding Material-LiAlSiO4 System", Materials Science Forum, Vols. 620-622, pp. 715-718, 2009

Online since:

April 2009

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.