Simulation Investigation of Tangential-Feed Centerless Grinding Process Performed on Surface Grinder

Wei Xing Xu; Yong Bo Wu; Takashi Sato; Wei Min Lin

doi:10.4028/www.scientific.net/MSF.626-627.23

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Tool Wear Monitoring: An Automated System Based on Multiple Cutting Force Parameters and Machine Vision Technique
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The Predictive Model of Surface Roughness and Searching System in Database for Cutting Tool Grinding
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Experimental Study of Tangential-Feed Centerless Grinding Process Performed on Surface Grinder
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Simulation Investigation of Tangential-Feed Centerless Grinding Process Performed on Surface Grinder
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Damaged Layer Analysis for AFM-Based Mechanical Modifications on (100) Si Surface
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A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate
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Analysis of Factors Effecting Profile Accuracy of Metal-Bonded Ball-Headed Diamond Wheel in Electrical Discharge Dressing Process
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Study on the Machinability of Glass Soda-Lime in Diamond Cutting Process
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HomeMaterials Science ForumMaterials Science Forum Vols. 626-627Simulation Investigation of Tangential-Feed...

Simulation Investigation of Tangential-Feed Centerless Grinding Process Performed on Surface Grinder

Abstract:

In our previous study, a new centerless grinding method using surface grinder was proposed. This paper describes a simulation method for investigating the workpiece rounding process in which a model taking the elastic deformation of the machine into consideration is created, and revealing how the process parameters affect the machining accuracy in the new grinding technique. In addition, a practice way to determine the machining-elasticity parameter showing the elastic deformation is developed. The simulation results are compared to show the effect of process parameters on the machining accuracy.