Damaged Layer Analysis for AFM-Based Mechanical Modifications on (100) Si Surface

Jeong Woo Park; Nam Hun Kim

doi:10.4028/www.scientific.net/MSF.626-627.29

Paper Titles

Tool Wear Monitoring: An Automated System Based on Multiple Cutting Force Parameters and Machine Vision Technique
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The Predictive Model of Surface Roughness and Searching System in Database for Cutting Tool Grinding
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Experimental Study of Tangential-Feed Centerless Grinding Process Performed on Surface Grinder
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Simulation Investigation of Tangential-Feed Centerless Grinding Process Performed on Surface Grinder
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Damaged Layer Analysis for AFM-Based Mechanical Modifications on (100) Si Surface
p.29

A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate
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Analysis of Factors Effecting Profile Accuracy of Metal-Bonded Ball-Headed Diamond Wheel in Electrical Discharge Dressing Process
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Study on the Machinability of Glass Soda-Lime in Diamond Cutting Process
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Research on Deliquescent Polishing Fluid for KDP Crystals
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HomeMaterials Science ForumMaterials Science Forum Vols. 626-627Damaged Layer Analysis for AFM-Based Mechanical...

Damaged Layer Analysis for AFM-Based Mechanical Modifications on (100) Si Surface

Abstract:

Micro/Nanofabrication of silicon substrate based on the atomic force microscope (AFM) followed by wet chemical etching was demonstrated. A specially designed cantilever with a diamond tip, allowing the formation of damaged layer on silicon substrate by a simple scratching process, has been applied instead of conventional Si or Si3N4-based micro cantilever for scanning. A thin damaged layer forms in the substrate at the diamond tip-sample junction along scanning path of the tip, which was found to be a low crystallized amorphous silicon layer. Hence these sequential processes, called tribo nanolithography, TNL, can fabricate 2D or 3D micro structures in nanometer range. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool. According to our results, it has been clearly known that the damaged layer withstands against aqueous potassium hydroxide solution, while it dissolves in diluted hydro fluoric (DHF) solution.

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Advances in Materials Manufacturing Science and Technology XIII Volume I

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Materials Science Forum (Volumes 626-627)

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29-34

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https://doi.org/10.4028/www.scientific.net/MSF.626-627.29

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Online since:

August 2009

Authors:

Jeong Woo Park, Nam Hun Kim

Keywords:

Atomic Force Microscope (AFM), Cantilever, Damaged Layer, Lithography, Mask Effect, Mechanical Modification, Silicon, Tribo-Nanolithography TNL

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