Microstructural Development in a Ternary Al-Cu-Si Alloy during Transient Solidification

Abstract:

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Macrosegregation and microporosity formation numerical models are dependent on microstructural parameters, such as primary and secondary arm spacings to provide the permeability coefficient in the mushy zone. As can be observed in the literature, growth models for ternary alloys for unsteady solidification are rarely found. In this paper, the primary (λ1) dendrite arm spacing was measured along the length of an Al-Cu-Si alloy casting and correlated with transient solidification thermal variables. A combined theoretical and experimental approach has been carried out to quantitatively determine such thermal variables, i.e., transient metal/mold heat transfer coefficient, liquidus isotherm velocity and cooling rate ahead the liquidus front.

Info:

Periodical:

Materials Science Forum (Volumes 636-637)

Edited by:

Luís Guerra ROSA and Fernanda MARGARIDO

Pages:

643-650

DOI:

10.4028/www.scientific.net/MSF.636-637.643

Citation:

I. L. Ferreira et al., "Microstructural Development in a Ternary Al-Cu-Si Alloy during Transient Solidification ", Materials Science Forum, Vols. 636-637, pp. 643-650, 2010

Online since:

January 2010

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Price:

$35.00

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