Al/Ni Self-Propagating Exothermic Film for MEMS Application

Takahiro Namazu; Shozo Inoue

doi:10.4028/www.scientific.net/MSF.638-642.2142

Paper Titles

Electron Beam Surface Modification of Cobalt Chrome Molybdenum Alloy Formed by a Laminate Molding Method
p.2121

Preparation of Ti-Based and Zr-Based Bio-Metallic Wires by Arc-Melting Type Melt-Extraction Method
p.2127

Second Step Approach for Self Healing Ceramics
p.2133

Properties of New TiC/TiB₂/Fe-Al Cermet Alloy
p.2138

Al/Ni Self-Propagating Exothermic Film for MEMS Application
p.2142

High-Temperature Oxidation Resistance and Crack-Healing Function of Ni/Al₂O₃ Nano-Hybrid Materials
p.2148

(Zn,Mn)Te-Based Nanowires for Spintronic Applications: A TEM Study of Structural and Chemical Properties
p.2154

Fabrication of Cu-Based Functionally Graded Materials Dispersing Fine Sic Particles by a Centrifugal Mixed-Powder Method
p.2160

FEM Analysis of Joint Interface Formation in Magnetic Pressure Seam Welding
p.2166

HomeMaterials Science ForumMaterials Science Forum Vols. 638-642Al/Ni Self-Propagating Exothermic Film for MEMS...

Al/Ni Self-Propagating Exothermic Film for MEMS Application

Abstract:

This paper describes evaluation of the strength in Ag-Sn-jointed Si specimens heated by Al/Ni film’s exothermic reaction. The reaction generates heat enough to melt Ag-Sn film for soldering. To measure the strength, four-point micro-bending test technique has been developed. The rectangular-solid Si specimens having a Ag-Sn/AlNi/Ag-Sn section were prepared by dicing the bonded Si-wafer under various pressure loads. A higher pressure yielded a better contact condition between Al/Ni and Ag-Sn so that heat-conduction improved; consequently Ag-Sn was melted sufficiently. Al/Ni reactive film has a potential as a micro-heater in soldering for MEMS.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Materials Science Forum (Volumes 638-642)

Pages:

2142-2147

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.638-642.2142

Citation:

Cite this paper

Online since:

January 2010

Authors:

Takahiro Namazu, Shozo Inoue

Keywords:

Al/Ni Multilayer Film, Bonding Strength, Exothermic Reaction, Four-Point Bending Test, Micro-Electromechanical System (MEMS), Packaging, Solder Bonding

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] T. Namazu, Y. Tashiro, and S. Inoue: J. Micromech. Microeng. Vol. 17, No. 1 (2007), p.154.

Google Scholar

[2] J. Wang, E. Besnoin, O. M. Knio, and T. P. Weihs: Acta Materialia, Vol. 52 (2004), p.5265.

DOI: 10.1016/j.actamat.2004.07.012

Google Scholar

[3] A. Duckham, S. J. Spey, J. Wang, M. E. Reiss, and T. P. Weihs: J. Applied Physics, Vol. 96 (2004), p.2336.

Google Scholar

[4] T. S. Dyer and Z. A. Munir: Metallurgical and Materials Transactions, Vol. 26B (1995), p.603.

Google Scholar

[5] T. Namazu, H. Takemoto, H. Fujita, Y. Nagai, and S. Inoue: Proc. of The 19th IEEE Int. Conf. on Microelectromech. Syst. (2006), p.286.

Google Scholar

[6] H. Fujita, T. Namazu, and S. Inoue: Proc. of The 7th Int. Conf. of Adv. Technol. in Exp. Mech. (2007), OS05-3-1 (CD-ROM). Fig. 10 A schematic of the proposed fracture mechanism.

Google Scholar