For interconnect materials in the microelectronic technology copper has replaced aluminum due to its lower resistivity, higher thermal conductivity and better electromigration resistance. Recently, it was found that nanotwinned copper exhibits ultra high yield strength, ductility and electrical conductivity. Therefore, in this study the effect of plating current density and frequency were investigated on the crystallographic texture of Cu electrodeposited to understand the twin character. Electron backscatter diffraction (EBSD) was used for characterizing the preferred orientation, grain size distribution, and grain boundary character distribution. Three kinds of <110>, <111> and <112> textures were found to be related with the electrodeposited parameters of current density and frequency. Here we will discuss the relationship between the preferred orientation and the electrodeposited parameters.