Microstructure of Bonding Interface in Explosively Welded Metal/Ceramic Clad

Abstract:

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Bonding interface in aluminum (Al) and silicon nitride (Si3N4) clad fabricated by explosive welding has been investigated by transmission electron microscopy (TEM). The nanocrystalline region was clearly observed at the interface between Al and Si3N4. Electron diffraction pattern and energy dispersive X-ray spectroscopy (EDS) measurements across the interface revealed that this nanocrystalline region consist of the only aluminum.

Info:

Periodical:

Materials Science Forum (Volumes 638-642)

Main Theme:

Edited by:

T. Chandra, N. Wanderka, W. Reimers , M. Ionescu

Pages:

3775-3780

DOI:

10.4028/www.scientific.net/MSF.638-642.3775

Citation:

S. Ii et al., "Microstructure of Bonding Interface in Explosively Welded Metal/Ceramic Clad", Materials Science Forum, Vols. 638-642, pp. 3775-3780, 2010

Online since:

January 2010

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Price:

$35.00

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