Microstructure of Bonding Interface in Explosively Welded Metal/Ceramic Clad
Bonding interface in aluminum (Al) and silicon nitride (Si3N4) clad fabricated by explosive welding has been investigated by transmission electron microscopy (TEM). The nanocrystalline region was clearly observed at the interface between Al and Si3N4. Electron diffraction pattern and energy dispersive X-ray spectroscopy (EDS) measurements across the interface revealed that this nanocrystalline region consist of the only aluminum.
T. Chandra, N. Wanderka, W. Reimers , M. Ionescu
S. Ii et al., "Microstructure of Bonding Interface in Explosively Welded Metal/Ceramic Clad", Materials Science Forum, Vols. 638-642, pp. 3775-3780, 2010