Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

Abstract:

Article Preview

The effects of Ni on the properties of the Sn-2.5Ag-0.7Cu-0.1Re solder alloy and its creep properties of solder joints are researched. The results show that with adding 0.05wt% Ni in the Sn-2.5Ag-0.7Cu-0.1Re solder alloy, the elongation can be sharply improved without decreasing its tensile strength and it is 1.4 times higher than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. Accordingly the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints is the longest, which is 13.3 times longer than that of Sn-2.5Ag-0.7Cu-0.1Re and is also longer than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. In the same environmental conditions, the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints can sharply decrease with increasing the temperature and stress.

Info:

Periodical:

Edited by:

Yafang Han, Tianmin Wang and Shaoxiong Zhou

Pages:

91-96

DOI:

10.4028/www.scientific.net/MSF.650.91

Citation:

K. K. Zhang et al., "Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints", Materials Science Forum, Vol. 650, pp. 91-96, 2010

Online since:

May 2010

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.