Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

Ke Ke Zhang; Yao Li Wang; Yan Li Fan; Guo Ji Zhao; Yan Fu Yan; Xin Zhang

doi:10.4028/www.scientific.net/MSF.650.91

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HomeMaterials Science ForumMaterials Science Forum Vol. 650Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy...

Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

Abstract:

The effects of Ni on the properties of the Sn-2.5Ag-0.7Cu-0.1Re solder alloy and its creep properties of solder joints are researched. The results show that with adding 0.05wt% Ni in the Sn-2.5Ag-0.7Cu-0.1Re solder alloy, the elongation can be sharply improved without decreasing its tensile strength and it is 1.4 times higher than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. Accordingly the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints is the longest, which is 13.3 times longer than that of Sn-2.5Ag-0.7Cu-0.1Re and is also longer than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. In the same environmental conditions, the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints can sharply decrease with increasing the temperature and stress.

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Periodical:

Materials Science Forum (Volume 650)

Pages:

91-96

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.650.91

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Online since:

May 2010

Authors:

Ke Ke Zhang, Yao Li Wang, Yan Li Fan, Guo Ji Zhao, Yan Fu Yan, Xin Zhang

Keywords:

Creep Rupture Life, Elongation, Sn-2.5Ag-0.7Cu-0.1RE-XNi Lead Free Solder, Solder Joint, Tensile Strength

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