Dynamic recrystallization (DRX) behaviour in a newly developed Cu-Sn-P alloy for heat exchangers and tubes was systematically investigated. For this purpose, Cu-Sn-P alloys with different content of Sn were deformed in compression at temperatures between 1073 K and 1213 K and at various strain rates from 2 x 10-4 s-1 to 2 x 10-1 s-1. The onset of DRX was more advanced with increasing temperature and with decreasing strain rate. Full DRX was not achieved at the testing conditions of lower temperature and higher strain rate even after straining to ε = 1.0. This tendency was more significant in the alloy with higher Sn content. With increasing Sn content, the flow stress and the obtained grains size became higher and finer, respectively. These experimental results indicate the important role of Sn for strengthening and microstructual control.