The Addition of Silica Nanoparticles with Different Sizes for a Silica Film on Stainless Steel without Crack Formation

Abstract:

Inorganic protective silica film was tried on the surface of stainless steel using a sol-gel chemical route where tetraethoxysilane (TEOS) and methyltriethoxysilane (MTES) were used. In the coating solution silica nanoparticles with different sizes were mixed. Then the film was deposited on the stainless steel substrate. It was intended that by mixing the small and the large particles at the same time a sufficient consolidation of the film was possible because of the high surface activity of the small nanoparticles and a modest silica film would be obtained with a low temperature heat treatment at as low as 200 °C. The prepared film showed enhanced adhesion when compared with a silica film without nanoparticle additions. The films also showed improved protect-ability against corrosion. Scanning electron microscopy (SEM), scratch test, potentiodynamic polarization scan and electrochemical impedance analysis were also used to characterize the films.

• Periodical: Materials Science Forum (Volumes 654-656)
• Pages: 1815-1818
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.654-656.1815
• Online since: June 2010
• Authors: Hoh Yeong Kim, Gyun Tak Kim, Heung Yeol Lee, Tae Jin Hwang
• Keywords: Crack-Free, Protective Silica Film, Silica Nanoparticle, Sol-Gel Process

References

[1] L. Peguet, B. Balki and B. Baroux: Corr. Sci. Vol. 51 (2009), p.493.

[2] K.H. Lo, C.H. Shek and J.K.L. Lai: Mater. Sci. & Eng. R Vol. 65 (2009), p.39.

[3] A.J. López, A. Ureña and J. Rams: Surf. & Coat Technol. Vol. 203 (2009), p.1474.

[4] M. Atik, P. Neto, L.A. Avaca and M.A. Aegerter: Ceram. Int. Vol. 21 (19955), p.403.

[5] H. Li, K. Liang, L. Mei, S. Gu and S. Wang: J. Mater. Sci. Lett. Vol. 20 (2001), p.1081.

[6] U. Vijayalakshmi and S. Rajeswari: J. Sol-Gel Sci. Technol. Vol. 43 (2007), p.251.

[7] P. Galliano, J.J.D. Damborenea, M.J. Pascual and A. Duran: J. Sol-Gel Sci. Technol. Vol. 13 ( 1998), p.723.

[8] D.C.L. Vasconcelos, J.A.N. Carvalho, M. Mantel and W.L. Vasconcelos: J. Non-Cryst. Solids Vol. 273 (2000), p.135.

[9] J.G. Checmanowski and B. Szczygiel: J. Non-Cryst. Solids Vol. 354 (2008), p.1786.

[10] F. Feil, W. Furbeth and M. Schutze, Electrochim. Acta Vol. 54 (2009), p.2478.

[11] G.P. Thim, M.A.S. Oliveira, E.D.A. Oliveira and F.C.L. Melo: J. Non-Cryst. Solids Vol. 273 (2000), p.124.

[12] C.J. Brinker and G.W. Scherer: Sol-Gel Science (Academic Press, Inc. U.S. Boston 1990).

[13] C.J. Brinker, A.J. Hurd, P.R. Schunk, G.C. Frye and C.S. Ashley: J. Non-Cryst. Solids Vol. 147-148 (1992), p.424.

DOI: 10.1016/s0022-3093(05)80653-2