Investigation on Interfacial Bonding Strength of Anisotropic Conducive Adhesive with a New Cohesive Zone Model

Abstract:

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A modified cohesive zone interface model with a damage factor was proposed to describe the effects of the thermal cycle and humidity aging on the strengths of adhesive joints. The damage factor can not only change the cohesive zone bonding strength but also affect the energies of separation. The modified cohesive zone interfacial model, as a user subroutine, is developed and implemented in ABAQUS to simulate the 90° peeling process of the specimens, which were bonded by anisotropic conducive adhesive film (ACF) and subjected to the cycle and humidity aging tests. The numerical simulated results well agree with experimental results, which confirmed the validity of the new model.

Info:

Periodical:

Materials Science Forum (Volumes 654-656)

Main Theme:

Edited by:

Jian-Feng Nie and Allan Morton

Pages:

1928-1931

DOI:

10.4028/www.scientific.net/MSF.654-656.1928

Citation:

J. Zhang et al., "Investigation on Interfacial Bonding Strength of Anisotropic Conducive Adhesive with a New Cohesive Zone Model", Materials Science Forum, Vols. 654-656, pp. 1928-1931, 2010

Online since:

June 2010

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Price:

$35.00

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