Formation and Mechanical Properties of Intermetallic Compounds in Sn-Cu High-Temperature Lead-Free Solder Joints

Abstract:

High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.

• Periodical: Materials Science Forum (Volumes 654-656)
• Pages: 2450-2454
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.654-656.2450
• Online since: June 2010
• Authors: De Kui Mu, Hideaki Tsukamoto, Han Huang, Kazuhiro Nogita
• Keywords: High-Temperature Lead-Free Solder, Intermetallic Compound (IMC), Mechanical Property, Nanoindentation

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DOI: 10.1016/b978-075067509-3/50001-4

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