Electroless Copper Plating on Ti3SiC2 Powder Surface Using Ascorbic Acid as a Reducing Agent

Abstract:

Article Preview

Cu-coated Ti3SiC2 powder was fabricated by electroless copper plating method from CuSO4 using poisonless ascorbic acid (C6H6O4(OH)2) as reducing agent. Sensibilization and activation on Ti3SiC2 powder surface was performed by Sn-Ag catalyst system. Surfactants lauryl sodium sulfate (SDS) and Polysorbate 80 (Tween-80) were used as modifiers to control copper particle sizes and shapes. It is found that good pretreatment and activation can obtain fully-formed copper coating. The optimal copper deposition rate can reach to 2.053 g.dm-2.h-1 at 80°C . The best coating effect can be obtained in the samples modifying with 12g/L SDS+8ml/L Tween-80.

Info:

Periodical:

Edited by:

Hyungsun Kim, JianFeng Yang, Tohru Sekino, Masakazu Anpo and Soo Wohn Lee

Pages:

471-474

DOI:

10.4028/www.scientific.net/MSF.658.471

Citation:

Y. R. Cui et al., "Electroless Copper Plating on Ti3SiC2 Powder Surface Using Ascorbic Acid as a Reducing Agent", Materials Science Forum, Vol. 658, pp. 471-474, 2010

Online since:

July 2010

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.