Aging Behavior of Cu-Ni-Si Alloy Processed by High-Pressure Torsion

Abstract:

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An age-hardenable Cu-2.9%Ni-0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to ~150 nm and the Vickers microhardness was significantly increased through the HPT process. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis revealed that fine precipitates with sizes of ~20 nm or smaller were formed in the Cu matrix and some particles consist of Ni and Si with no appreciable amount of Cu.

Info:

Periodical:

Materials Science Forum (Volumes 667-669)

Edited by:

Jing Tao Wang, Roberto B. Figueiredo and Terence G. Langdon

Pages:

307-312

DOI:

10.4028/www.scientific.net/MSF.667-669.307

Citation:

H. Matsunaga et al., "Aging Behavior of Cu-Ni-Si Alloy Processed by High-Pressure Torsion", Materials Science Forum, Vols. 667-669, pp. 307-312, 2011

Online since:

December 2010

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Price:

$35.00

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