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On the Theoretical Limits of Microstructure Evolution in Severe Plastic Deformation
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Effect of Multiaxial Forging on Structure Evolution and Mechanical Properties of Oxygen Free Copper
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Microstructure Evolution of Pure Nickel up to a High Strain Level during Equal-Channel Angular Pressing
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Aging Behavior of Cu-Ni-Si Alloy Processed by High-Pressure Torsion

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Abstract:

An age-hardenable Cu-2.9%Ni-0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to ~150 nm and the Vickers microhardness was significantly increased through the HPT process. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis revealed that fine precipitates with sizes of ~20 nm or smaller were formed in the Cu matrix and some particles consist of Ni and Si with no appreciable amount of Cu.

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Periodical:

Materials Science Forum (Volumes 667-669)

Pages:

307-312

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.667-669.307

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Online since:

December 2010

Authors:

Hirotaka Matsunaga, Z. Horita, Kazutaka Imamura, Takanobu Kiss, Xavier Sauvage

Keywords:

3DAP, Cu-Ni-Si, Electrical Conductivity, High Pressure Torsion (HPT), Ultrafine Grained

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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