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Viscosity of Sn-Cu Solders Investigated by Molecular Dynamics

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Abstract:

The self-diffusion coefficient of Cu in Sn-1.5wt.%Cu and Sn-2wt.%Cu lead-free solders was investigated using molecular dynamics simulations based on a modified embedded-atom method from 503 K to 773 K. Then the viscosity of the solders was calculated using the selfdiffusion coefficient values, and the results were in good agreement with the experimental data. Two segments, a low-temperature zone and a high-temperature zone, were found on both η–T and lnη–1/T plots, where η is the viscosity and T is the absolute temperature. Through analysis, we infer that the viscosity mutation was attributed to the remarkable structure transition.

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Periodical:

Materials Science Forum (Volumes 675-677)

Pages:

1011-1014

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.675-677.1011

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Online since:

February 2011

Authors:

Rui Fang Ding, Xue Min Pan, Guang Ling Wei

Keywords:

MEAM, Molecular Dynamic (MD), Viscosity

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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DOI: 10.1016/b978-075067509-3/50001-4

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