Viscosity of Sn-Cu Solders Investigated by Molecular Dynamics

Abstract:

Article Preview

The self-diffusion coefficient of Cu in Sn-1.5wt.%Cu and Sn-2wt.%Cu lead-free solders was investigated using molecular dynamics simulations based on a modified embedded-atom method from 503 K to 773 K. Then the viscosity of the solders was calculated using the selfdiffusion coefficient values, and the results were in good agreement with the experimental data. Two segments, a low-temperature zone and a high-temperature zone, were found on both η–T and lnη–1/T plots, where η is the viscosity and T is the absolute temperature. Through analysis, we infer that the viscosity mutation was attributed to the remarkable structure transition.

Info:

Periodical:

Materials Science Forum (Volumes 675-677)

Edited by:

Yi Tan and Dongying Ju

Pages:

1011-1014

DOI:

10.4028/www.scientific.net/MSF.675-677.1011

Citation:

R. F. Ding et al., "Viscosity of Sn-Cu Solders Investigated by Molecular Dynamics", Materials Science Forum, Vols. 675-677, pp. 1011-1014, 2011

Online since:

February 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.