Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films

Renaud Vayrette; Christian Rivero; Sylvain Blayac; Karim Inal

doi:10.4028/www.scientific.net/MSF.681.139

Paper Titles

Thin Film Stress and Texture Analysis at the MCX Synchrotron Radiation Beamline at ELETTRA
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Influence of Surface Roughness on Evaluation of Stress Gradients in Coatings
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Thermal Residual Stress Relaxation in Sputtered ZnO Film on (100) Si Substrate Studied In Situ by Synchrotron X-Ray Diffraction
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Residual Stresses and Strength of Hard Chromium Coatings
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Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films
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Evaluation of Arc Evaporated Coatings on Rounded Surfaces and Sharp Edges
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Experimental Verification of the Hole Drilling Plasticity Effect Correction
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Residual Stress Analysis Using the Hole-Drilling Method and Geometry-Specific Calibration Functions
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Residual Stress Measurement in Coated Plates Using Layer Growing/ Removing Methods: 100^Th Anniversary of the Publication of Stoney’s Paper “the Tension of Metallic Films Deposited by Electrolysis”
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HomeMaterials Science ForumMaterials Science Forum Vol. 681Thickness Effect on Microstructure and Residual...

Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films

Abstract:

In this work, coupled effects of thickness and annealing temperature on both microstructure and residual stress of electroplated copper thin films are studied. Microstructure is investigated by Electron Backscattered Diffraction (EBSD) and residual stress is estimated from samples curvature. All films exhibit highly twinned grains. Except for several microns films, median crystallite size grows with both film thickness and annealing temperature. Concerning residual stress, it decreases, first as the increase of film thickness, and secondly as the decrease of annealing temperature. The comparison between experiments and stress models demonstrates that the root mechanisms of residual stress generation change with annealing temperature. As well as annealing temperature, film thickness determines the level of residual stress through control of microstructure. Furthermore, EBSD investigations confirmed that the relevant microstructural length to define mechanical properties of thin copper films is the median crystallite size.