Interfacial Microstructures and Kinetics of Sn2.5Ag0.7Cu/Cu

Abstract:

The interfacial microstructures and kinetics of low Ag content Sn2.5Ag0.7Cu/Cu solder joint were investigated by the X-ray diffraction, scanning electronic microscope and energy spectrum analysis during the isothermal aging. The results show that the interfacial microstructures of the Sn2.5Ag0.7Cu/Cu solder joint are composed of Cu₃Sn and Cu₆Sn₅ after soldering. With the aging time increasing, the intermetallic compound (IMC) pattern of the solder joint interface can be changed from the scallop-like to the shape-layer, and the growing dynamics is coincidence with the law of parabola and its growing behavior is controlled by diffusion. The growing activation energies values of Cu₃Sn and Cu₆Sn₅ layer at the Sn2.5Ag0.7Cu/Cu solder joint are 82.4kJ/mol and 69.6kJ/mol respectively.

• Periodical: Materials Science Forum (Volume 687)
• Pages: 112-116
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.687.112
• Online since: June 2011
• Authors: Yao Li Wang, Ke Ke Zhang, Chen Yang Li, Li Juan Han, Qing Zhi Zhang
• Keywords: Activation Energy, Aging, Growing Dynamic, Interfacial Microstructure, SnAgCu Solder Alloy

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