K-Type Thin Film Thermocouples Deposited on Ni-Based Superalloy Substrates

Y. Z. Chen; C. R. Wang; Hong Chuan Jiang; Wan Li Zhang; X.Z. Liu; Yan Rong Li

doi:10.4028/www.scientific.net/MSF.687.684

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HomeMaterials Science ForumMaterials Science Forum Vol. 687K-Type Thin Film Thermocouples Deposited on...

K-Type Thin Film Thermocouples Deposited on Ni-Based Superalloy Substrates

Abstract:

NiCr-NiSi K-type thin film thermocouples with multi-layer structure were fabricated on Ni-based superalloy substrates (95 mm×35 mm×2 mm). The multi-layer structure contains NiCrAlY buffer layer (2 μm)/ thermally grown Al₂O₃ bond coating (200 nm)/ Al₂O₃ insulating layer (8 μm)/ NiCr-NiSi thin film thermocouples (1 μm)/ Al₂O₃ protecting layer (500 nm). The samples were statically calibrated in a tube furnace in the temperature range from 170 °C to 610 °C. The results show that the resistance of Al₂O₃insulating layer is about 14.6 kΩ at 800 °C and exceeds 100 MΩ at room temperature. The Seebeck coefficient a of the samples is about 34 μV/°C, and the sensitivity coefficient K is greater than 0.8 in the temperature range from 170 °C to 610 °C. The maximal sensitivity coefficient is about 0.97 at 265 °C.

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Materials Science Forum (Volume 687)

Pages:

684-687

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.687.684

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Online since:

June 2011

Authors:

Y. Z. Chen, C. R. Wang, Hong Chuan Jiang, Wan Li Zhang, X.Z. Liu, Yan Rong Li

Keywords:

NiCr-NiSi, Seebeck Coefficient, Sensitivity Coefficient, Thin Film Thermocouple

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