Preparation of the Multi-Layer Copper and Nickel Foam by Electrodeposition
The multi-layer copper/nickel foam was prepared by the electrodeposition methods adopted the polyurethane as frame foundation. The foam is provided with a three-dimension grid structure and porosity of 96%-98%. The morphology of foam was examined by scanning electron microscope in synthesis procedure. The main physical characteristics of multi-layer copper/nickel foam were determined. Its apparent density and pore size are 190-210 kg/m3 and 1.4-1.7 mm respectively.
Hyungsun Kim, Jian Feng Yang, Chuleol Hee Han, Somchai Thongtem and Soo Wohn Lee
Q. L. Zhang et al., "Preparation of the Multi-Layer Copper and Nickel Foam by Electrodeposition", Materials Science Forum, Vol. 695, pp. 557-560, 2011