Preparation of the Multi-Layer Copper and Nickel Foam by Electrodeposition

Abstract:

The multi-layer copper/nickel foam was prepared by the electrodeposition methods adopted the polyurethane as frame foundation. The foam is provided with a three-dimension grid structure and porosity of 96%-98%. The morphology of foam was examined by scanning electron microscope in synthesis procedure. The main physical characteristics of multi-layer copper/nickel foam were determined. Its apparent density and pore size are 190-210 kg/m³ and 1.4-1.7 mm respectively.

• Periodical: Materials Science Forum (Volume 695)
• Pages: 557-560
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.695.557
• Online since: July 2011
• Authors: Qiu Li Zhang, Xuan Cheng, Xin Zhe Lan, Xiao Yan Hu
• Keywords: Electro-Deposition, Multi-Layer Copper/Nickel, Preparation

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