Preparation of the Multi-Layer Copper and Nickel Foam by Electrodeposition

Abstract:

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The multi-layer copper/nickel foam was prepared by the electrodeposition methods adopted the polyurethane as frame foundation. The foam is provided with a three-dimension grid structure and porosity of 96%-98%. The morphology of foam was examined by scanning electron microscope in synthesis procedure. The main physical characteristics of multi-layer copper/nickel foam were determined. Its apparent density and pore size are 190-210 kg/m3 and 1.4-1.7 mm respectively.

Info:

Periodical:

Edited by:

Hyungsun Kim, Jian Feng Yang, Chuleol Hee Han, Somchai Thongtem and Soo Wohn Lee

Pages:

557-560

DOI:

10.4028/www.scientific.net/MSF.695.557

Citation:

Q. L. Zhang et al., "Preparation of the Multi-Layer Copper and Nickel Foam by Electrodeposition", Materials Science Forum, Vol. 695, pp. 557-560, 2011

Online since:

July 2011

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Price:

$35.00

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