Study on Acoustic Emission Signatures during the Process of Edge Chipping for Engineering Ceramics

Xiu Jian Tang; Xin Li Tian; Jian Quan Wang; Ya Tao Mao; F.Q. Li

doi:10.4028/www.scientific.net/MSF.697-698.93

Paper Titles

Chip Thickness Analysis in Peripheral Milling of Curved Surfaces with Variable Curvature Considering Cutter Runout
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Grinding Capability of the Indigenous Polymer-Based Solid Lubricant Coating Wheels Used in Dry Grinding
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Research on the Influence Factors for the Deflection of Micro-Ball-End Cutter in Micro-End-Milling Process
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An Experimental Study of Antirust Additives Ratio for Green Water-Based Lubricant
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Study on Acoustic Emission Signatures during the Process of Edge Chipping for Engineering Ceramics
p.93

Identification of Bolt Connection Parameters for Vertical Grinding Machine in CAD/CAE Environment
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Experimental Study in HSM of Titanium Alloy TC4-DT
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Influences of Grinding Parameters on Forces in the Grinding of Microwave Ferrite Ceramic with Electroplated Diamond Wheel
p.107

Identification of Material Constitutive Parameters Using Orthogonal Cutting Tests and Genetic Algorithm
p.112

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Study on Acoustic Emission Signatures during the Process of Edge Chipping for Engineering Ceramics

Abstract:

The developments of edge chipping for engineering ceramics are analyzed. An edge chipping experiment under static load is adopted to study the fracture process of edge chipping. The results show that the fracture processes of edge chipping under different edge distances are similar, which can be divided into four stages based on load-displacement curve. There is obviously Kaiser Effect during the fracture processes of edge chipping. Counts, average frequency, RMS, duration, amplitude and inverse calculation can be used to describe the process of edge chipping for engineering ceramics. Amplitude, duration and average frequency become highly active on the eve of fracture, which can be regard as the omens of edge chipping and used to predict the fracture of edge chipping.