Study on Acoustic Emission Signatures during the Process of Edge Chipping for Engineering Ceramics
The developments of edge chipping for engineering ceramics are analyzed. An edge chipping experiment under static load is adopted to study the fracture process of edge chipping. The results show that the fracture processes of edge chipping under different edge distances are similar, which can be divided into four stages based on load-displacement curve. There is obviously Kaiser Effect during the fracture processes of edge chipping. Counts, average frequency, RMS, duration, amplitude and inverse calculation can be used to describe the process of edge chipping for engineering ceramics. Amplitude, duration and average frequency become highly active on the eve of fracture, which can be regard as the omens of edge chipping and used to predict the fracture of edge chipping.
Tian Huang, Dawei Zhang, Bin Lin, Anping Xu, Yanling Tian and Weiguo Gao
X. J. Tang et al., "Study on Acoustic Emission Signatures during the Process of Edge Chipping for Engineering Ceramics", Materials Science Forum, Vols. 697-698, pp. 93-96, 2012