Elemental Distribution Characteristics Across γ-TiAl:TiAlV Diffusion Bond Interface

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Abstract:

In the present study diffusion bonding of γ-TiAl intermetallic with Ti-6Al-4V alloy was carried out in high vacuum. The diffusion bonding was performed at temperatures of 800°C and 850°C under the constant pressure of 40MPa and at varying time. The interfacial microstructure formed during the diffusion bonding was analysed by SEM and TEM. The elemental distribution characteristics across the interface were also studied by X-ray EDS analysis. From EDS results obtained, some regions were rich in aluminium and some regions were rich in vanadium. Also there are some compositional variations such as chromium and niobium close to the interface zone. However, the composition gradient was not gradual across the interface. Strong evidence has been found for the solute re-distribution in a more localized manner.

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Periodical:

Materials Science Forum (Volumes 702-703)

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718-721

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December 2011

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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[1] N. F. Kazakov, Diffusion Bonding of Materials, Moscow, (1981)

Google Scholar

[2] N.S. Stoloff, C.T. Liu and S.C. Deevi, Intermetallics 8 (2000) 1313-1320

Google Scholar

[3] Edward A. Loria, Intermetallics 9 (2001) 997-1001

Google Scholar

[4] P.L. Threadgill, Mater. Sci. Engg. A, 192/193 (1995) 640-646

Google Scholar

[5] X F. Wang, M. Ma and X. B. Liu, J Mater. Sci., 42 (2007) 4004-4008

Google Scholar

[6] W. H. King and W. A. Owczarski, Additional Studies on the Diffusion Welding of Titanium, Welding Research Supplement (1968) 444-450

Google Scholar

[7] C. H. Hamilton, Proc. Conf. on Superplastic Forming, ASM, (1985) 13

Google Scholar