Importance of Microscale Texture and Grain Boundary Connectivity to Percolation-Dependent Bulk Properties in Polycrystalline Materials

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Abstract:

Bulk properties of polycrystalline structural and functional materials are controlled by the grain boundary microstructure defined by the grain boundary character distribution (GBCD) and grain boundary connectivity, because of percolation-dependent grain boundary phenomena. It has been found that there is a close relationship between microscale texture and grain boundary microstructure. Since percolation-controlled grain boundary phenomena are involved and playing key roles in the generation of various kinds of bulk properties, the relationship between texture and grain boundary microstructure can be effectively used as a powerful tool in development of high performance structural and functional materials by Grain Boundary Engineering (GBE).

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Materials Science Forum (Volumes 702-703)

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703-709

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December 2011

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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[17] T Watanabe, Grain boundary engineering in textured materials, Proc.ICOTOM-11, (1996), 1309-1318 .

Google Scholar

[18] T Watanabe, H Fujii, H Oikawa, K I Arai, Grain boundaries in rapidly solidified and annealed Fe-6.5mass%Si polycrystalline ribbons with high ductility, Acta Met, 37 (1989), 941-952.

DOI: 10.1016/0001-6160(89)90021-7

Google Scholar

[19] T Watanabe, K I Arai, K Yoshimi, H Oikawa, Phil Mag. Letters, 59 (1989), 47-52.

Google Scholar

[20] A. Garbacz, M. W. Grabski: Modelling of CSL boundaries distribution in polycrystals, Scripta Met, 23 (1989), 1369-1374.

DOI: 10.1016/0036-9748(89)90061-6

Google Scholar

[21] V Y Gertsman, A P Zhilyaev, A L Pshenichniuk, R Z Variev, Modelling of grain boundary misorientation spectrum in polycrystals with crystallographic texture, Acta Met Mater, 40(1992), 1433-1441.

DOI: 10.1016/0956-7151(92)90445-k

Google Scholar

[22] A Garbacz, M W Grabski, The relationship between texture and CSL boundaries distribution in polycrystalline materials, I, II, Acta Met Mater, 41 (1993), 409-473, 475-483.

DOI: 10.1016/0956-7151(93)90076-5

Google Scholar

[23] L Zuo, T Watanabe, C Esling, A theoretical approach to grain boundary character distribution (GBCD) in textured polycrystalline materials, Z Metallkde, 85 (1994), 554-558.

DOI: 10.1515/ijmr-1994-850804

Google Scholar

[24] L C Lim, R Raj, On the distribution of S for grain boundaries in polycrystalline nickel prepared by strain-annealing technique, Acta Met, 32 (1985), 1177-1181.

DOI: 10.1016/0001-6160(84)90124-x

Google Scholar

[25] J Don, S Majumdar, Creep cavitation and grain boundary structure in type 304 stainless steel, Acta Met, 34 (1986), 961-987

DOI: 10.1016/0001-6160(86)90069-6

Google Scholar

[26] P. Fortier, W. A. Miller, K. T. Aust, Triple junction and grain boundary character distribution in metallic materials, Acta Met, 45 (1997), 3459-3467.

DOI: 10.1016/s1359-6454(97)00004-9

Google Scholar

[27] M Shimada, H Kokawa, Z J Wang, Y S Sato, I Karibe, Optimization of grain boundary character distribution for intergranular corrosion resistant 304 stainless steel by twin-induced grain boundary engineering, Acta Mater, 50 (2002), 2331-2341.

DOI: 10.1016/s1359-6454(02)00064-2

Google Scholar

[28] C A Schuh, M Kumar, W King: Analysis of grain boundary networks and their evolution during grain boundary engineering, Acta Met, 51(2003), 687-700

DOI: 10.1016/s1359-6454(02)00447-0

Google Scholar

[29] M Fray and C. A. Schuh, Connectivity and percolation behavior of grain boundary networks in three dimensions, Phil Mag, 85 (2005), 1123-1143.

DOI: 10.1080/14786430412331323564

Google Scholar

[30] S Tsurekawa, S Nakamichi, T Watanabe, Correlation of grain boundary connectivity with grain boundary character distribution in austenitic stainless steel, Acta Mater, 54 (2006), 3617-3626.

DOI: 10.1016/j.actamat.2006.03.048

Google Scholar

[31] M Michiuchi, H Kokawa, Z J Wang, Y S Sato, K Sakai, Twin-induced grain boundary engineering for 316 austenitic stainless steel, Acta Mater, 54 (2006), 5179-5184.

DOI: 10.1016/j.actamat.2006.06.030

Google Scholar

[32] G Gottstein, L S Schvinderman, B Zhao, Thermodynamics and kinetics of grain boundary triple junctions in metals: Recent developments, Scripta Mater., 62 (2019), 914-917.

DOI: 10.1016/j.scriptamat.2010.03.017

Google Scholar

[33] B Zhao, J Ch Verhasset, L S Schvindlerman, G Gottstein, Measurement of grain boundary triple line energy in copper, Acta Mater, 58 (2010), 564605653.

Google Scholar

[34] S Tsurekawa, K Kido, T Watanabe, Measurements of potential barrier height of grain boundaries in polycrystalline silicon by Kelvin probe force microscopy, Phil Mag Letters, 85 (2005), 41-49.

DOI: 10.1080/09500830500153859

Google Scholar