Microstructure Evolution and Mechanical Behaviour of Severe Plastically Deformed Cu

Garima Sharma; Apu Sarkar; Indradev Samajdar; J.K. Chakravartty

doi:10.4028/www.scientific.net/MSF.702-703.93

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HomeMaterials Science ForumMaterials Science Forum Vols. 702-703Microstructure Evolution and Mechanical Behaviour...

Microstructure Evolution and Mechanical Behaviour of Severe Plastically Deformed Cu

Abstract:

The present study reports the microstructure evolution and mechanical behaviour of severe plastically deformed pure Cu under cryogenic conditions. The samples were severely deformed by cryo rolling upto 50%, 75% and 95% deformation. Microstructure evolution of cryo rolled samples has been characterized by using optical, TEM and EBSD technique. The rolled samples were heat treated at various temperatures so as to control the recrystallization in the severely deformed samples. The effect of recrystallization on the mechanical behaviour was investigated in detail by tensile testing. The EBSD analysis performed on 95% rolled + heat treated samples showed that partial recystallized microstructure demonstrate an optimum combination of strength and ductility in cryo rolled Cu.

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Materials Science Forum (Volumes 702-703)

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93-96

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https://doi.org/10.4028/www.scientific.net/MSF.702-703.93

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Online since:

December 2011

Authors:

Garima Sharma, Apu Sarkar, Indradev Samajdar, J.K. Chakravartty

Keywords:

Copper, Cryo Rolling, Deformation Behavior, Hardness, Ultra-Fine Grain (UFG)

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