Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-Temperature Electronics

Akio Hirose; Naoya Takeda; Yosuke Konaka; Hiroaki Tatsumi; Yusuke Akada; Tomo Ogura; Eiichi Ide; Toshiaki Morita

doi:10.4028/www.scientific.net/MSF.706-709.2962

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Effect of Water Cooling on Grain Structures and General Mechanical Properties of 2219-T6 Friction Stir Welded Joint
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HomeMaterials Science ForumMaterials Science Forum Vols. 706-709Low Temperature Sintering Bonding Process Using Ag...

Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag₂O for Packaging of High-Temperature Electronics

Abstract:

A novel bonding process using Ag₂O paste composed of Ag₂O particles and a reducing agent has been proposed as a Pb-free alternative of high melting point solders in electronics packaging. Ag₂O paste formed Ag nanoparticles through the redox reaction in the bonding process and in-situ formed Ag nanoparticles sintered immediately. While the bonding process using Ag metallo-organic nanoparticles, which have been proposed, was unfavorable to the bonding at 250 degree Celsius or lower in terms of requiring removal of stable organic shells, the bonding process using Ag²O paste demonstrated the possibility of further low-temperature bonding.

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Periodical:

Materials Science Forum (Volumes 706-709)

Pages:

2962-2967

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.706-709.2962

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Online since:

January 2012

Authors:

Akio Hirose, Naoya Takeda, Yosuke Konaka, Hiroaki Tatsumi, Yusuke Akada, Tomo Ogura, Eiichi Ide, Toshiaki Morita

Keywords:

Ag Nanoparticle, Ag₂O Particles, Electronics Packaging, Pb Free, Sintering Bonding

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References

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