Annealing Phenomena in Cu/Ni Composite Electrodeposit

Abstract:

Cu/Ni composite electrodeposit was fabricated by electroplating nickel on the both sides of an electroplated copper sheet. In order to lower interfacial stresses between copper and nickel, the microstructure of nickel was controlled to consist of grains with a mean size of 15 nanometers. The different parts of the composite electrodeposit underwent different evolution of textures and microstructures during annealing. In the Cu electrodeposit, the as-deposited texture characterized by a relatively high <100>//ND and twin components transformed to be diffuse due to grain growth during annealing above 300°C. This is attributed to a large number of twins conducting the as-deposited microstructure. On the other hand, in the Ni electrodeposit, grain growth that takes place during annealing above 250°C corresponds to abnormal grain growth in terms of the scale change of the grain size. This grain growth also transformed the as-deposited texture of strong <100>//ND into a diffuse texture. In the interface between copper and nickel, the atomic diffusion was generated by excessive vacancies resulting from the grain growth during the annealing of nanostructured Ni electrodeposit. An 'interface texture' began to developed in the previous Cu region above 500°C, and the microtexture development was similar to the growth texture of the annealed Ni electrodeposit.

• Periodical: Materials Science Forum (Volumes 715-716)
• Pages: 952-952
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.715-716.952
• Online since: April 2012
• Authors: K.H. Kim, D.H. Kang, Yong Bum Park
• Keywords: EBSD, Electro-Deposition, Grain Growth, Texture

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