Fast Inspection of Non-Visual Defects in the Wafer Surface Using Two Low-Energy E-Beam Sources

Seong Joon Ahn; Tae Sik Oh; Dae Wook Kim; Ho Seob Kim; Seung Joon Ahn

doi:10.4028/www.scientific.net/MSF.724.439

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HomeMaterials Science ForumMaterials Science Forum Vol. 724Fast Inspection of Non-Visual Defects in the Wafer...

Fast Inspection of Non-Visual Defects in the Wafer Surface Using Two Low-Energy E-Beam Sources

Abstract:

Although the electron-beam (e-beam) inspection can find the non-visual defects in the semiconductor devices under the fabrication procedure, it has a problem of low inspection speed. To resolve this problem, in this work, we have demonstrate the low-energy e-beam inspection using a tiny microcolumn as the e-beam source. The experimental result indicates that the non-visual defects in the wafer can be easily identified by measuring the e-beam current at the backside of the wafer. Since it is not difficult to make the multiple e-beam sources by packing many microcolumns, we can enhance the inspection many times by using the microcolumn e-beam sources.

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Periodical:

Materials Science Forum (Volume 724)

Pages:

439-442

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.724.439

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Online since:

June 2012

Authors:

Seong Joon Ahn, Tae Sik Oh, Dae Wook Kim, Ho Seob Kim, Seung Joon Ahn

Keywords:

E-Beam Source, Fast Inspection, High-Aspect-Ratio Contacts, Low-Energy, Microcolumn, Non-Visual Defects

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References

[1] H.S. Kim, D.W. Kim, Y.C. Kim, S. Ahn, and S.J. Ahn, J. Korean Phys. Soc. Vol. 55 (2009), p.1758.

Google Scholar

[2] E. Kratschmer, H.S. Kim, M.G.R. Thomson, K.Y. Lee, S.A. Rishton, M.L. Yu, S. Zolgharnain, B.W. Hussey, and T.H. Chang, J. Vac. Sci. Technol. B Vol. 14 (1996), p.3792.

Google Scholar

[3] M.G.R. Thomson, J. Vac. Sci. Technol. B Vol. 12 (1994), p.3498.

Google Scholar

[4] H.S. Kim, M.L. Yu, M.G.R. Thomson, E. Kratschmer, and T.H. Chang, J. Appl. Phys. Vol. 81 (1997), p.461.

Google Scholar