Analysis of Bonging Temperature and Interfacial Characterization of 3Y-TZP and SUS304 by Diffusion Bonding

Ming Zhao; Dong Ying Ju

doi:10.4028/www.scientific.net/MSF.750.164

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HomeMaterials Science ForumMaterials Science Forum Vol. 750Analysis of Bonging Temperature and Interfacial...

Analysis of Bonging Temperature and Interfacial Characterization of 3Y-TZP and SUS304 by Diffusion Bonding

Abstract:

This paper studies mainly the diffusion bonding of 3Y-TZP/SUS304 by using the chemical bonding method. In the bonding interface of 3Y-TZP and SUS304, the Ti-Cu powder/sheet was used as bonding materials. In bonding process, multi-alloy with Fe-Ti and Fe-Cu have been confirmed by Electron Probe Micro-Analyzer (EPMA) determination. Through the microstructure observed by AFM and SEM, bonding boundaries of 3Y-TZP/SUS304 by Ti-Cu powder/sheet had good formation. The distribution of the residual stress on near interface was measured by XRD method. By using of these results, the mechanism of the ceramic and stainless steel was discussed.

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Periodical:

Materials Science Forum (Volume 750)

Pages:

164-167

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.750.164

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Online since:

March 2013

Authors:

Ming Zhao, Dong Ying Ju

Keywords:

3Y-TZP, AFM, Diffusion Bonding, Microstructure, SUS304

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References

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