Kinetics of Thermal Grooving during Low Temperature Recrystallization of Pure Aluminum

Abstract:

The migration of a recrystallization boundary in pure aluminum was followed during in situ annealing in a scanning electron microscope. The microstructure was characterized using the electron channeling contrast technique and a typical stop-go grain boundary motion was observed during annealing. The thermal grooving associated with boundary migration on the inspected free surface was characterized after the in-situ experiment using atomic force microscopy. The results show that new thermal grooves develop at places where the recrystallization boundary segments remain stationary for a relatively long time. The kinetics of thermal grooving are determined and effects hereof on the boundary migration are discussed.

• Periodical: Materials Science Forum (Volume 753)
• Pages: 117-120
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.753.117
• Online since: March 2013
• Authors: Yu Bin Zhang, Andy Godfrey, Dorte Juul Jensen
• Keywords: Aluminum (Al), Atomic Force Microscope (AFM), Boundary Migration, Thermal Grooves

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