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HomeMaterials Science ForumMaterials Science Forum Vol. 753Grain Boundary Dynamics under an Applied Stress

Grain Boundary Dynamics under an Applied Stress

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Abstract:

The response of various structurally different planar grain boundaries in aluminum bicrystals to an applied stress was experimentally investigated. Stress induced boundary migration was observed to be coupled to a tangential translation of the grains for symmetrical and asymmetrical and tilt boundaries with both low and high misorientation angles. The activation enthalpy of high angle boundary migration was found to vary non-monotonously with misorientation angle, whereas for low angle boundaries the migration activation enthalpy was virtually the same. The Σ7 CSL boundaries in bicrystals of different geometry were observed to move under an applied stress, but their migration did not produce shear. These crystallographically equivalent boundaries, however, were found to behave different with respect to migration rate and its temperature dependence. The stress driven migration of the mixed tilt-twist boundary was observed to be accompanied by both the translation of adjacent grains parallel to the boundary plane and their rotation around the boundary plane normal. This behavior was interpreted in terms of the structure of the investigated tilt-twist boundary.

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Recrystallization and Grain Growth V

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Periodical:

Materials Science Forum (Volume 753)

Pages:

101-106

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.753.101

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Online since:

March 2013

Authors:

Dmitri A. Molodov

Keywords:

Bi-Crystal, Dislocation, Grain Boundary Migration, Shear Stress

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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