Microstructure and Reaction Mechanism of Multi-Laminated Ti-(SiCp/Al) Composites Subjected to Annealing at 1300°C

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The multi-laminated Ti-(SiCp/Al) composite was produced by hot press and subsequent hot roll bonding of Ti and SiCp/Al foils. The microstructure evolution of the composite in reaction annealing was investigated by scanning electron microscope (SEM) equipped with energy dispersive X-ray spectrometer (EDX) and X-ray diffractometer (XRD). The results show that after the reaction annealing at 1300°C for 3h, the Ti and SiCp/Al foils were completely consumed and transformed into the TiAl composite with a microlaminated structure. The microlaminated microstructure of the composite is composed of Ti3Al/(TiAl+Ti5Si3p)/Ti5Si3/duplex-phase (TiC+Ti3AlC) layers. The reaction mechanism is elucidated by employing the reaction model.

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526-530

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July 2013

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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[1] W.J. Zhang, B.V. Reddy, S.C. Deevi: Scripta Mater. Vol. 45 (2001), p.645

Google Scholar

[2] C.J. Boehlert: Mater. Sci. Eng. A Vol. 267 (1999), p.82

Google Scholar

[3] C.T. Liu, J.H. Schneibel, P.J. Maziasz, J.L. Wright, D.S. Easton: Intermetallics Vol. 4 (1996), p.429

Google Scholar

[4] V.M. Sglavo, M. Bertoldi: Acta Mater. Vol. 54 (2006), p.4929

Google Scholar

[5] A. Kidane, A. Shukla: Eng. Fract. Mech. Vol. 77 (2010), p.479

Google Scholar

[6] S.Y. Lee, J. Wadsworth: J. Alloys Comp. Vol. 25 (1991), p.842

Google Scholar

[7] M. Lugovy, V. Slyunyayev, N. Orlovskaya: Acta Mater. Vol. 53 (2005), p.289

Google Scholar

[8] J.G. Luo, V.L. Acoff: Mater. Sci. Eng. A Vol. 379 (2004), p.164

Google Scholar

[9] L.M. Peng, J. H. Wang, H. Li. J.H. Zhao, L.H. He: Scripta Mater. Vol. 52 (2005), p.243

Google Scholar

[10] G.P. Chaudhari, V.L. Acoff: Intermetallics Vol. 18 (2010), p.472

Google Scholar

[11] Y.F. Wu, G.Y. Kim, I.E. Anderson, T.A. Lograsso: Acta Mater. Vol. 58 (2010), p.4398

Google Scholar

[12] X.J. Wang, X.S. Hu, K. Wu: J. Mater. Sci. Vol. 44 (2009), p.2759

Google Scholar

[13] X.P. Cui, G.H. Fan, L. Geng, Y. Wang, L.J. Huang, H.X. Peng: Mater. Sci. Eng. A Vol. 539 (2012), p.337

Google Scholar

[14] J.L. Zhang: Intermetallics Vol. 18 (2010), p.2292

Google Scholar

[15] G.L. Zhu, Y.B. Dai, D. Shu, Y.P. Xiao, Y.X. Yang, J. Wang, B.D. Sun, R. Boom: Comput.Mater. Sci. Vol. 50 (2011), p.2636.

Google Scholar