Paper Titles
Control of Oriented Extracellular Matrix Similar to Anisotropic Bone Microstructure
p.72
Biofunctional Surface Layer and its Bonding Strength in Low Modulus β-Type Titanium Alloy for Biomedical Applications
p.78
Effects of Austenite Conditioning and Transformation Temperature on the Bainitic Microstructure in Linepipe Steels
p.85
A Numerical Model for Predicting the Zener-Hollomon Parameter in the Friction Stir Processing of AZ31B
p.93
Corrosion Resistance of Al-Cu Alloys in Function of the Microstructure
p.100
Microstructure, Fracture and Mechanical Properties of ECAPed Aluminum P/M Alloy with Respect to the Porosity
p.108
Deformation of AA6016 Aluminum Alloy Sheets at High Temperature and Strain Rate
p.114
High Thermal Conductivity Aluminum Powder Metallurgy Materials
p.120
Finite Element Simulation of Diffusion and Precipitation with Application to Internal Oxidation of Ni-Xwt%Cr Alloys at 950°C
p.126

Corrosion Resistance of Al-Cu Alloys in Function of the Microstructure

Article Preview

Abstract:

Aluminum and its alloys are characterized by low density, high electrical and thermal conductivity, and good resistance to corrosion in certain media such as air. The mechanical strength alloy is achieved. The objective of the present research consist on studying the type of structure (columnar, equiaxed or with columnar to equiaxed transition, CET) using parameters of the solidification process and electrochemical parameters in Al, Cu and Al-Cu alloys with different concentrations. In order to obtain columnar, equiaxed and CET structures, the alloys were directionally solidified upwards in an experimental set up with a set of thermocouples in the samples which permit to determine the time dependent profiles during the process. The electrochemical studies of the samples were realized by using an electrochemical impedance spectroscopy (EIS) technique and potentio-dynamic polarization curves immersed in 3% NaCl solution at room temperature. In general, we observed that the susceptibility to corrosion of the different structures depends on the size of the secondary dendritic spacing and the proportion of Al2Cu phase and Al-rich phase.

You might also be interested in these eBooks
THERMEC 2013 View Preview

Info:

Periodical:

Materials Science Forum (Volumes 783-786)

Pages:

100-107

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.783-786.100

Citation:

Cite this paper

Online since:

May 2014

Authors:

Alejandra Silvina Román*, Claudia Marcela Méndez, Alicia Esther Ares

Keywords:

Al-Cu Alloys, Corrosion, Electrochemical Impedance

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

References

[1] J. R Galvele, G.S. Duffo, Degradación de materiales I: Corrosión, Jorge Baudino Ediciones, Buenos Aires, Argentina, (2003).

Google Scholar

[2] S.S. Rosatto, P.L. Cabot, P.T.A. Sumodjo, A.V. Benedetti, Electrochemical studies of copper–aluminum–silver alloys in 0. 5 M H2SO4, Electrochimica Acta. 46 (2001) 1043–1051.

DOI: 10.1016/s0013-4686(00)00685-x

Google Scholar

[3] A. E. Ares, L. M. Gassa, C. M. Mendez, Carlos E. Schvezov, Corrosión electroquímica de las aleaciones Al-Cu en solución de cloruro de sodio; Anales SAM/CONAMET, 2011, 11° Congreso Binacional de Metalurgia y Materiales – SAM/CONAMET 2011. Rosario, Argentina, (2011).

DOI: 10.3989/revmetalm.0931

Google Scholar

[4] W.R. Osório, J.E. Spinelli, I.L. Ferreira, A. Garcia, The rol of macrosegregation and of dendritic array spacings on the electrochemical behavior of an Al-4. 5wt%Cu alloy, Electrochimica Acta. 52 (2007) 3265-3273.

DOI: 10.1016/j.electacta.2006.10.004

Google Scholar

[5] Z. Szklarska-Smialowska, Pitting corrosion of aluminium, Corrosion Science. 41 (1999) 1743-1767.

DOI: 10.1016/s0010-938x(99)00012-8

Google Scholar

[6] J.M. Flores, R.D. Romero, J, G LLongueras, Espectroscopia de Impedancia Electroquímica. Notas. Instituto Mexicano del Petróleo, Facultad de Química UNAM.

Google Scholar

[7] B.A. Boukamp, Equivalent Circuit, University of Twente, (1989).

Google Scholar

[8] C. M. Rodriguez, Relación entre la microestructura y la microdureza de las aleaciones Al-Cu solidificadas direccionalmente, Instituto Sábato, CNEA- UNSaM, (2013).

DOI: 10.31527/analesafa.2013.23.2.42

Google Scholar

[9] ASM International, ASM Handbook, Vol. 3, Metallography and Microstructures, George F. Vander Voort. ASM International, (2004).

Google Scholar

[10] J. Esteban, M. Lowry, M.E. Orazem, Correction of experimental data for the ohmic potential drop corresponding to a secondary current distribution on a disk electrode, in: L.L. Scribner, S.R. Taylor (Eds. ), The Measurement and Correction of Electrolyte Resistance in Electrochemical Tests, ASTM STP, 1056, American Society for Testing and Materials, Philadelphia, (1990).

DOI: 10.1520/stp25284s

Google Scholar