Hot Compression Deformation Behaviors and Microstructure Evolution for Brittle Au-20Sn Eutectic Alloy

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The hot compression test of Au-20Sn alloys with different solidification structures was carried out. The deformation behaviors and microstructure evolutions during hot compression were investigated. The results indicate that the fine fully lamellar eutectic structure without primary phase exhibited a very low yielding stress and a low stress platform, while the coarse lamellar with large primary Au5Sn phase showed rather high in that value. After compression, the lamellar eutectic tended to be equiaxed due to dynamic recrystallization, the large primary phase became separate dendrites or split into small dendrites, and the small roselike primary phase partly dissolved in the eutectic matrix. The rate of recrystallization also increased as the primary phase eliminated and lamellae was refined. It is suggested that refining eutectic lamellae and eliminating the primary Au5Sn phase in the as-cast microstructure by solidification optimization are an effective way to improve the workability greatly for brittle Au-20Sn eutectic alloy.

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409-414

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April 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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[1] C.W. Tan, Y.C. Chan, B. Leung, H.D. Liu, Effects of soft beam energy on the microstructure of Pb37Sn, Au20Sn, and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application, Opt. Lasers Eng. 46(2008) 75-82.

DOI: 10.1016/j.optlaseng.2007.06.007

Google Scholar

[2] X.S. Liu, M.H Hu, H.K. Nguyen et al., Comparison between epi-down and epi-up bonded high-power single-mode 980-nm semiconductor lasers,  IEEE Trans Adv Pack. 27(2004) 640-646.

DOI: 10.1109/tadvp.2004.831862

Google Scholar

[3] K.A. Lee, Y.M. Jin, Y.H. Sohn, J. Namkung, M.C. Kim, Continuous strip casting, microstructure and properties of Au-Sn soldering alloy, Met. and Mater. Int. 17(2011) 7-14.

DOI: 10.1007/s12540-011-0202-4

Google Scholar

[4] X.F. Wei, R.C. Wang, C.Q. Peng, F. Yan, X.W. Zhu, Microstructural evolutions of Cu(Ni)/AuSn/Ni joints during reflow, Prog. Nat. Sci.: Mater. Int. 21(2011) 347-354.

DOI: 10.1016/s1002-0071(12)60068-9

Google Scholar

[5] Q.B. Tan, C. Deng, Y. Mao, G. He, Evolution of primary phases and high-temperature compressive behaviors of as-cast AuSn20 alloys prepared by different solidification pathways, Gold Bull. 44(2011) 27-35.

DOI: 10.1007/s13404-011-0004-y

Google Scholar

[6] V. Chidambaram, J. Hald, J. Hattel, Development of gold based solder candidates for flip chip assembly, Microelectronics Reliab. 49(2009) 323-330.

DOI: 10.1016/j.microrel.2008.12.012

Google Scholar

[7] J.J. Song, D.Y. Guo, L. Cai, Y. Mao, Au-Sn eutectic alloy solidification microstructure with fine full lamellar structure, Chin. J. Rare Met. 37(2013) 44-48.

Google Scholar

[8] Z.G. Liu, D.Q. Chen, X.M. Luo, K. Xu. Gold-Tin alloy solder for the package of microelectronics, Precious Met. 26(2005) 62-65.

Google Scholar

[9] H. Okamoto. Au-Sn (Gold-Tin), J. Phase Equilib. Diff. 28(2007) 490.

Google Scholar